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Frequently askedquestions

Do you have questions about PIR boards, their installation, or technical parameters? Here you will find answers to the most frequently asked questions from our customers and contractors. We have gathered them in one place to give you quick access to key information.

Frequently askedquestions

Polyurethane is currently the fifth most commonly used plastic in the world. It is used in numerous industries, from footwear, furniture, electronics, automotive, and even construction. In the latter, it is primarily used as a thermal insulation material in the form of panels or spray foam. Its versatility stems from the ability to vary its properties within a wide range by modifying its composition and manufacturing process.

Yes. Polyurethanes are materials that are safe for health and the environment. PIR boards do not contain formaldehyde or other harmful substances. They are resistant to fungi and mould and do not provide a food source for rodents.

The cost of insulation using PIR boards without cladding may initially be higher than traditional materials, but thanks to their superior insulating properties, a thinner layer of insulation can be used, which translates into long-term savings.

Thermal resistance is one of three values that determine the thermal insulation of a building partition. Calculating thermal resistance requires knowledge of the lambda coefficient and the thickness of the material. Formula: R = d/λ, where d is the thickness in metres and λ is the thermal conductivity coefficient.

Thermal resistance R characterises a material of a specific thickness and is equal to the quotient of the material thickness and the thermal conductivity coefficient lambda. The unit of thermal resistance is (m²·K)/W. When selecting insulation material, thermal resistance R is more important than the lambda coefficient itself, as it takes into account the thickness of the material.

The heat transfer coefficient is a parameter indicating the amount of heat that flows through one square metre of a partition per second when there is a temperature difference of 1 K (Kelvin) between both sides of the partition. The unit of the heat transfer coefficient is W/(m²·K). Lambda λ is the thermal conductivity coefficient, i.e. the property of a material that determines its ability to conduct heat.

The standard dimensions of PIR boards manufactured at PCC Therm, without cladding and with aluminium cladding, are 1200 x 600 mm. The boards are manufactured in thicknesses ranging from 20 mm to 300 mm in 10 mm increments, as well as in thicknesses of 25, 35, 45, 55, 65, 75, 85 and 95 mm. It is also possible to manufacture boards in non-standard thicknesses and dimensions.

Compressive strength is a mechanical property of a material that characterises its ability to transfer compressive loads. It is the compressive stress at which the material deforms by a specified amount (usually 10% of the sample height). According to the standard, compressive strength is determined by compressing the sample in a direction parallel to the surface of the board (in the direction of thickness). Compressive strength should not be confused with compressive strength.

The most important application of PIR boards without cladding is thermal insulation of external walls in ETICS thermal insulation systems. Boards without cladding allow for perfect adhesion of the adhesive to the entire surface of the board. This allows loads to be transferred from the outer layer to the building's supporting structure through the insulation board. In addition, unclad PIR boards are ideal for thermal insulation on the inside of structures in contact insulation of walls, ceilings or roofs. In such applications, the boards are usually fixed mechanically using expansion plugs or screws. Unclad PIR boards can also be used in seamless insulation. In such cases, the boards are welded together by welding the edges using a special electric PIR welding machine or by foaming the joints with a special single-component polyurethane foam.

The acronyms PUR and PIR stand for polyurethane foam and polyisocyanurate foam, respectively. Both foams are based on polyurethane chemistry, but PIR has a higher content of isocyanurate bonds in its macromolecular structure than PUR. The higher content of these bonds gives PIR better mechanical properties at elevated temperatures, as well as better fire properties. The isocyanurate contained in PIR is converted into carbon when exposed to heat. This process is called charring. The carbon produced by the decomposition of isocyanurate acts as a thermal barrier, effectively slowing down the further transfer of heat into the material.

PIR board is a new generation polyisocyanurate foam board based on polyurethane chemistry. Thanks to a special catalyst, additional isocyanurate bonds are formed in the structure of the material, which are very thermally stable. PIR is characterised by very good thermal insulation properties combined with thermal resistance and limited flammability.

Polyurethane foam plastics are obtained through the polyaddition of polyisocyanate with polyol, in the presence of catalysts, foaming agents and various additives that modify the properties of the final product. Due to the speed of the manufacturing reaction, polyurethane foam can be applied directly to surfaces intended for insulation or formed into blocks, from which boards are then cut.

Polyurethane is currently the fifth most commonly used plastic in the world. It is used in many industries, ranging from footwear, furniture, electronics and automotive to construction. In the latter, it is mainly used as a thermal insulation material in the form of boards or spray foam. Its versatility stems from the possibility of changing its properties within wide limits by modifying its composition and manufacturing process.